PLATING EQUIPMENT

The WPS ECD-Au-4C Series, Electro Chemical Deposition Wet Process System is designed to process Si, GaAs and Ceramic substrates for Au Electro Chemical Deposition process using both Cyanide and Sulfide based solutions. The System is designed for use with Wafer Process Systems Inc. proprietary cathode and anode assemblies for processing single substrates in a horizontal orientation (Fountain Plating) for single side deposition or vertical orientation for single side deposition. The Plating Rectifier Interface is a 15 inch colored touch screen display with Windows® based software for local programming and monitoring of power supply settings. The interface can be remote or incorporated into the system weldment. The System is constructed out of FM Approved 4910 Compliant flame retardant PVC-C, Kynar® (PVDF) or Halar® (ECTFE) for corrosion resistance to all process solutions. Safety and ergonomics are main aspects in the system design. All fluid components are accessible through removable front and rear access panels. All electrical components are accessible through front control panels and rear access panels and incorporate interlock switches with EPO interface for safety. Standard features include emergency power off circuit with remote mushroom switch, remote load center and contactor,  Photohelicâ low exhaust indicator with audible / visual alarm and EPO interface to eliminate the ability to operate equipment in the event of no exhaust, N2 purged head case with purge pressure interlock and EPO interface, plenum liquid level monitor with audible / visual alarm and EPO interface with auto DI water shutoff, back wall and plenum exhaust, recessed deck with 360° lip exhaust to insure capture of fumes during transfer  of wafers. All chemical wetted components are PVDF or PFA. All electrical components are UL, CSA or CE listed. All system electrical components are guaranteed for three years and All system DI Water components are guaranteed for three years and provide a 98% uptime.

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